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US 2004/0063304 A1Published application
Electronic component with a stack of semiconductor chips and a method for producing the electronic component
AssigneeInfineon Technologies AG
InventorsRobert-Christian Hagen, Holger Woerner
Life of this patent
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Abstract
The invention relates to a method for producing an electronic component, a stack of semiconductor chips, and an electronic component including a stack of semiconductor chips. The stack has at least a lower electronic module connected via flipchip connections to a central area of a rewiring substrate. The stack also has at least an upper electronic module with external contact surfaces connected via bonding connections to outer areas of the rewiring substrate.
Claims21
A method for producing an electronic component, which comprises:
- providing a rewiring substrate with a central area having connecting pads for forming flipchip connections, and providing the rewiring substrate with edge areas having connecting pads for bonding connections;
- providing a first lower electronic module formed as a semiconductor chip;
- using flipchip technology to apply the lower electronic module to the central area of the rewiring substrate;
- providing at least one second upper electronic module including a semiconductor chip and a rewiring structure with external contact surfaces;
- applying a passive rear face of the upper electronic module on a passive rear face of the lower electronic module;
- producing bonding connections between the external contact surfaces of the upper electronic module and the connecting pads in the edge areas of the rewiring substrate;
- and
- packaging the upper electronic module and the lower electronic module and applying a plastic packaging compound to the rewiring substrate.
5 more elements
An electronic component, comprising:
- a rewiring substrate having a central area with connecting pads for forming flipchip connections, said rewiring substrate having edge areas with connecting pads;
- at least one first lower electronic module formed by a semiconductor chip, said lower electronic module having contact areas electrically connected using flipchip technology to said connecting pads in said central area of said rewiring substrate, said lower electronic module having a passive rear face;
- at least one second upper electronic module including a rewiring structure and a semiconductor chip with external contact surfaces, said upper electronic module having a passive rear face resting against said passive rear face of said lower electronic module;
- a plurality of bonding connections between said external contact surfaces of said upper electronic module and said connecting pads in said edge areas of said rewiring substrate;
- and
- a component package surrounding said lower electronic module and said lower electronic module.
3 more elements
Dependencies are inferred from the claim text.