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OwnerChang-Han Yun, Lawrence E. Felton +4inventors
InventorsChang-Han Yun, Lawrence E. Felton, Maurice S. Karpman, John A. Yasaitis, Michael W. Judy, Colin Gormley
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A dummy handling substrate is used to form complex micro-electromechanical systems. A two-sided micromachined structure is fabricated by forming micromachined structures on a front side of a wafer, bonding the front side of the wafer to a dummy handling substrate, and forming micromachined structures on a back side of the wafer using the dummy handling substrate to handle the wafer during this back side processing. A second wafer containing micromachined features may be bonded to the back side of the first wafer using the dummy handling substrate to handle the first wafer during this bonding. The dummy handling substrate is removed from the front side of the wafer after back side processing and/or bonding of the second wafer.
A method for fabricating a micro-electromechanical system, the method comprising:
An apparatus comprising:
A micro-electromechanical system formed by the process of:
An integrated micro-electromechanical system formed by the process of:
Dependencies are inferred from the claim text.