Method for fabricating semiconductor device
AssigneeMatsushita Electric Industrial Co., Ltd.
InventorKazutoshi Onozawa
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Abstract
Formed first is a template having openings located to correspond to a pattern in which a plurality of semiconductor laser elements are to be arranged. Then, the template is held on the principal surface of a mounting wafer onto which the semiconductor elements are to be arranged. Subsequently, the semiconductor laser elements are dispersed into a fluid, and the semiconductor-laser-element-dispersed fluid is poured over the wafer on which the template is held. In this manner, the semiconductor laser elements are disposed into the respective openings of the template in a self-aligned manner.
Claims12
A semiconductor device fabrication method comprising the steps of
- (a) forming a template having openings that are located to correspond to a pattern in which a plurality of semiconductor elements in the form of chips are to be arranged,
- (b) holding the template on the principal surface of a substrate on which the semiconductor elements are to be arranged, and
- (c) spreading the semiconductor elements into a liquid and pouring the semiconductor-element-spread liquid over the substrate on which the template is held, thereby allowing the semiconductor elements to be disposed into the respective openings in the template in a self-aligned manner.
Dependencies are inferred from the claim text.