Redundant via rule check in a multi-wide object class design layout
AssigneeSun Microsystems, Inc.
InventorsMu-Jing Li, Amy Yang
Life of this patent
Estimating the term…
Loading patent…
AssigneeSun Microsystems, Inc.
InventorsMu-Jing Li, Amy Yang
Estimating the term…
A redundant via design rule check is preferably performed on multi-wide object class design layouts to ensure that each connection area between two conductive layers has at least a certain number of vias and/or has vias placed appropriately to reduce the risk of via failure due to vacancy concentration of isolated vias. In exemplary embodiments, a redundant via design rule check preferably ensures that for vias placed within a connection area of a metal feature (or within a localized region of a larger metal geometry) that is both greater than a certain width and greater than a certain area in size, the vias are both sufficient in number and/or suitable in their location. Vias located inside a geometry but falling outside a virtual edge of a wide class object may be included to satisfy exemplary rules.
A method for testing enclosure of vias by geometries of a design layout, said vias connecting geometries of a first layer to geometries of a second layer, said method comprising the steps of:
A method for testing via enclosure by geometries of a design layout, said vias connecting geometries of a first layer to geometries of a second layer, said method comprising the steps of:
A method of making a computer readable media product that encodes a design file representation of a design layout of an electronic circuit, said design layout having vias connecting geometries of a first layer to geometries of a second layer, said method comprising the steps of:
A method of processing one or more design files for an electronic circuit, the one or more design files encoding representations of a design layout of the electronic circuit, said design layout having vias connecting geometries of a first layer to geometries of a second layer, said method comprising the steps of:
An electronic circuit fabricated from a design layout representation thereof, said design layout having vias connecting geometries of a first layer to geometries of a second layer, said design layout being generated by the steps of:
A computer readable encoding of an electronic circuit design, the computer readable encoding comprising:
An apparatus for processing one or more design files for an electronic circuit, the one or more design files encoding representations of a design layout of the electronic circuit, said design layout having vias connecting geometries of a first layer to geometries of a second layer, said apparatus comprising:
A computer readable encoding of instructions for a computer, said instructions encoding a method for use with a design layout, for testing enclosure of vias by geometries of a design layout, said vias connecting geometries of a first layer to geometries of a second layer, said encoded method comprising the steps of:
Dependencies are inferred from the claim text.