Nozzle assembly, system and method for wet processing a semiconductor wafer

A nozzle assembly for dispensing an object processing fluid comprising:

• a nozzle structure having a chamber and an output opening, said chamber including at least two inlet openings to receive first and second fluids to combine said first and second fluids in said chamber to produce said object processing fluid, said chamber being in fluidal connection with said output opening to dispense said object processing fluid;
• and
• a flow control mechanism positioned between said chamber and said output opening to control dispensing of said object processing fluid from said chamber of said nozzle structure.

A nozzle assembly for dispensing an object processing fluid comprising:

• a nozzle structure having an opening to dispense said object processing fluid, said opening being in fluidal connection with at least two inlet conduits to individually receive first and second fluids so that said first and second fluids are combined at said nozzle structure to produce said object processing fluid;
• and
• an acoustic transducer operatively connected to said nozzle structure to generate acoustic energy that is imparted to said first and second fluids.

A method of processing an object comprising:

• receiving first and second fluids at a nozzle assembly;
• combining said first and second fluids in said nozzle assembly to form a processing fluid;
• dispensing said processing fluid from said nozzle assembly onto a surface of said object to process said object.