Heat sink and retaining clip assembly
AssigneeIntel Corporation
InventorsGeorge Hsieh, George R. Anderson, Cheryl M. Floyde
Life of this patent
Estimating the term…
Abstract
Apparatus and methods for secure attachment of a heat sink to its respective retention clip as well as attachment to an electronic device are presented. One embodiment of a retention clip retention apparatus consists of a protruding hip depending from a side of a heat sink protrusion adapted to capture the retention clip between the hip and the heat sink body. One embodiment of a method for forming the hip consists of using a tool to deform the heat sink protrusion. One embodiment of heat sink lateral retention apparatus consists of one or more split bobbins adapted to attach to the retention clip to prevent lateral motion of the heat sink with respect to the clip.
Claims24
Apparatus comprising:
- a frame;
- an electronic device mounted to the frame;
- a heat sink plate having a plurality of pins extending from a first surface thereof;
- and
- a retaining clip having at least one portion thereof coupled to the frame and adapted for engaging the first surface of the plate to force a second surface of the plate into thermal contact with a surface of the electronic device, the clip adapted for coupling with one or more of the pins extending from the heat sink plate for restricting longitudinal and transverse lateral movement of the heat sink relative to the surface of the device.
A clip for securing a heat sink to a surface of an electronic device, comprising:
- a central portion adapted for engaging the a first surface of the heat sink to force a second surface of the heat sink into contact with a surface of the electronic device, the central portion constructed and arranged for engaging one or more heat sink pins projecting from the first surface of the heat sink for restricting lateral and vertical movement of the heat sink relative to the surface of the device;
- and
- at least one leg portion extending from the central portion and adapted for attachment to a mounting frame supporting the electronic device.
A method of securing a heat sink to an electronic device, comprising:
- positioning the heat sink with a first surface thereof in thermal contact with a surface of the electronic device, a second surface thereof having a plurality of pins extending therefrom;
- positioning at least a portion of a transversely extending geometrical feature of a central portion of a clip into a transverse groove between adjacent rows of pins;
- and
- inserting the remainder of the central portion of the clip into a longitudinal groove between adjacent rows of pins, the transversely extending geometrical feature preventing longitudinal movement of the clip relative to the heat sink.
Dependencies are inferred from the claim text.