Multilayer ceramic package transmission line probe

A multilayer ceramic structure, comprising:

• a first ceramic layer;
• a second ceramic layer adjacent to the first ceramic layer;
• a transmission line formed between the first and second ceramic layers, the transmission line comprising first and second portions having a first width, third and fourth portions formed between the first and second portions and having a second width that is narrower than the first width, and a fifth portion formed between the third and fourth portions;
• and
• a probe, comprising a conductively filled via, attached at one end to the fifth portion, the probe passing through the second ceramic layer.

A multilayer structure, comprising:

• a first dielectric layer;
• a second dielectric layer adjacent to the first dielectric layer;
• a transmission line formed between the first and second dielectric layers, the transmission line comprising a first portion having a first inherent capacitance and inductance that causes a first return loss, and a second portion having a second inherent capacitance and inductance that causes a second return loss;
• and
• a conductive material formed within a via from the second portion through the second dielectric layer, the conductive material having a third inherent capacitance and inductance that causes a third return loss that counterbalances the second return loss.