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AssigneeIsothermal Systems Research, Inc.
InventorsCharles L. Tilton, Donald E. Tilton, Jeffrey K. Weiler
Estimating the term…
An integrated circuit heat dissipation system for reducing the number of junctions in packaged integrated circuits thereby decreasing thermal impedance and increasing thermal dissipation efficiency. The integrated circuit heat dissipation system includes a lid attached to a substrate, a cap attached about the lid creating a heat dissipation chamber, and a semiconductor chip attached to the lid by a thermally conductive adhesive. The lid may or may not form a cavity about the semiconductor chip depending upon the substrate utilized. The lid preferably includes a plurality of fins extending from thereof defining a plurality of channels or a plurality of grooves thereby increasing the heat flux of the lid.
An integrated circuit device, comprising:
An electronic system having an integrated circuit device, said integrated circuit device comprising:
A method of dissipating heat for an integrated circuit device package, comprising:
A method of dissipating heat for an integrated circuit device package, comprising:
Dependencies are inferred from the claim text.