Radiating structural body of electronic part and radiating sheet used for the radiating structural body
AssigneeShin-Etsu Chemical Co., Ltd.
InventorsKazuhiko Tomaru, Kunihiko Mita, Tsutomu Yoneyama
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Abstract
A heat dissipating structure for a heat generating electronic component is characterized by comprising a heat dissipating sheet including a metal sheet and a heat conductive member having adhesion stacked thereon between the heat generating electronic component and a heat dissipating member, wherein the metal sheet is connected to the heat generating electronic component, and the heat conductive member having adhesion is connected to the heat dissipating member.
Claims5
A heat dissipating structure for a heat generating electronic component, characterized by comprising a heat dissipating sheet including a metal sheet and a heat conductive member having adhesion stacked thereon between the heat generating electronic component and a heat dissipating member, wherein the metal sheet is connected to the heat generating electronic component, and the heat conductive member having adhesion is connected to the heat dissipating member.
A heat dissipating sheet interposed between a heat generating electronic component and a heat dissipating member, characterized by comprising a metal sheet disposed on the side of the heat generating electronic component and a heat conductive member having adhesion stacked on the metal sheet and disposed on the side of the heat dissipating member, wherein the heat conductive member having adhesion is formed of a heat conductive composition comprising at least one resin component selected from among siloxane polymers, acrylic polymers and polyolefin polymers, and a heat conductive filler, the composition being able to phase change or soften by the heat from the electronic component during operation.
Dependencies are inferred from the claim text.