US 2004/0056346 A1Published application

Power module with improved transient thermal impedance

AssigneeDaimlerChrysler AG

InventorsGerhard Palm, Yehia Tadros, Markus Thoben

Life of this patent

Estimating the term…

Loading patent…

Abstract

An electronic power module according to the invention comprises at least one electronic power device, a DCB ceramic substrate, a heat sink and at least one additional thermal capacitance, a) the electronic power devices being connected by means of a sintered layer on their underside to the upper copper layer of the DCB ceramic substrate, b) the upper copper layer of the DCB ceramic substrate being structured into copper conductor tracks for the electrical contacting of the power devices, c) the lower copper layer of the DCB ceramic substrate being connected by means of a sintered layer to a heat sink, d) the upper sides of the power devices being connected by means of a sintered layer to an additional thermal capacitance.

Claims13

Dependent claims

An electronic power module comprising at least one electronic power device (1), a DCB ceramic substrate (3, 4, 5), a heat sink (6) and at least one additional thermal capacitance (9, 9a, 9b, 12),

a) the electronic power devices (1) being connected by means of a sintered layer (2) on their underside to the upper copper layer (3) of the DCB ceramic substrate,
b) the upper copper layer (3) of the DCB ceramic substrate being structured into copper conductor tracks for the electrical contacting of the power devices (1),
c) the lower copper layer (5) of the DCB ceramic substrate being connected by means of a sintered layer (7) to a heat sink,
d) the upper side of the power devices (1) being connected by means of a sintered layer (10) to at least one additional thermal capacitance (9, 9a, 9b, 12).

1 more element

Dependencies are inferred from the claim text.

Facts

Application: 10/450,202Filed 7 Nov 2003
Priority: DE 100 62 108.213 Dec 2000
Published: 25 Mar 2004
Term ends: Not estimatedThe source records don’t support an estimate.

Classification5 codes

H10W 40/255
Characterised by their materials: having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates
H10W 72/07331
Of die-attach connectors: connecting techniques
H10W 72/325
Structures or relative sizes of die-attach connectors: die-attach connectors having a filler embedded in a matrix
H10W 72/352
Materials of die-attach connectors: comprising metals or metalloids, e.g. solders

Family

US 6,812,559 B2Related patent
US 2004/0056346 A1This patent

From the US filing history. Foreign family members aren’t listed.

Timeline

Citations

Open elsewhere

Building an agent or pulling many patents? Use the API or MCP server instead of scraping pages. Get an API key