Electronic device and method of manufacturing the same

A method of manufacturing an electronic device, comprising the steps of:

• fixing at least one semiconductor chip to a surface of a substrate which is a wiring substrate;
• electrically connecting electrodes formed on the semiconductor chip and wiring lines formed on the substrate with each other using a connecting means;
• molding an area including the semiconductor chip with an insulating resin to form a sealing member which covers the semiconductor chip and the connecting means;
• bonding the substrate through an adhesive to a recess formed in a back surface of a cap;
• and
• allowing the adhesive to cure,
• wherein a thermal expansion coefficient of a material which forms the substrate and that of a material which forms the sealing member are selected so that the substrate after molding warps in a centrally projected state toward a back surface of the substrate, and thereafter the substrate is fixed to the cap through the adhesive, peripheral edges of the substrate being not projected from the recess to the back surface of the cap, and the substrate being centrally warped so as to project in a direction away from the cap.

An electronic device comprising:

• a substrate having wiring lines;
• at least one semiconductor chip fixed to a surface of the substrate and having predetermined electrodes connected electrically to wiring lines of the substrate;
• a sealing member formed of an insulating resin on the surface of the substrate to cover a predetermined area including the semiconductor chip;
• and
• a cap having a recess formed in a back surface thereof which recess permits the substrate and the sealing member to be received therein,
• the sealing member on the substrate being received in the recess of the cap and the substrate being affixed on its surface side to the cap through an adhesive,
• wherein the recess comprises a shallow recess for fitting therein of the substrate and a deep recess formed in a bottom of the shallow recess for fitting therein of the sealing member, the substrate is fitted in the shallow recess and is affixed to the bottom of the shallow recess through the adhesive, the sealing member is affixed to a bottom of the deep recess through the adhesive,
• wherein peripheral edges of the substrate do not project from the shallow recess to the back surface of the cap,
• wherein the adhesive is positioned inside the peripheral edges of the substrate, and
• wherein the substrate is warped so that a central portion thereof projects in a direction away from the cap.