Field replaceable packard refrigeration module with vapor chamber heat sink for cooling electronic components

A circuit board, said circuit board comprising:

• at least one electronic component;
• a packaged refrigeration module for cooling said electronic component, said packaged refrigeration module comprising:
• a packaged refrigeration module housing;
• refrigerant;
• a compressor;
• a condenser;
• an expansion device;
• wherein,
• said compressor, said condenser and said expansion device are coupled together in a refrigeration loop within said packaged refrigeration module housing and said refrigerant is contained within said refrigeration loop such that said packaged refrigeration module is a self-contained module;
• and
• a vapor chamber heat sink, said vapor chamber heat sink being operatively coupled to said packaged refrigeration module refrigeration loop;
• wherein,
• said vapor chamber heat sink includes a vapor chamber heat sink evaporator cold-plate, said vapor chamber heat sink evaporator cold-plate being mounted directly over a first surface of said electronic component.

An electronic system, said electronic system comprising:

• a rack unit, said rack unit comprising:
• at least one electronic component;
• a packaged refrigeration module, said packaged refrigeration module comprising:
• a packaged refrigeration module housing;
• refrigerant;
• a compressor;
• a condenser;
• an expansion device;
• wherein,
• said compressor, said condenser, and said expansion device are coupled together in a refrigeration loop within said packaged refrigeration module housing and said refrigerant is contained within said refrigeration loop such that said packaged refrigeration module is a self-contained module;
• and
• a vapor chamber heat sink, said vapor chamber heat sink being operatively coupled to said packaged refrigeration module refrigeration loop;
• wherein,
• said vapor chamber heat sink includes a vapor chamber heat sink evaporator cold-plate, said vapor chamber heat sink evaporator cold-plate mounted directly over a first surface of said electronic component.