Low shrinkage thermosetting resin compositions and methods of use therefor

A compound comprising the following structure:

• 20
• wherein:
• each Q is independently substituted or unsubstituted phenylene, substituted or unsubstituted cyclohexylene, substituted or unsubstituted naphthylene, substituted or unsubstituted heterocyclic, or combinations of any two or more thereof;
• each X is optional and, if present, is independently —O—, —S—, —SO—, —SO2—, —S(O)2—N(R)—, —CO—, —N(R)—, —CO2—, —C(O)—N(R)—, —O—C(O)—O—, —O—C(O)—N(R)—, —N(R)—C(O)—N(R)—, —CR2—, or substituted or unsubstituted lower heteroalkenylene, wherein R is —H or substituted or unsubstituted lower alkyl;
• each L is optional and, if present, is independently substituted or unsubstituted alkylene or substituted or unsubstituted oxyalkylene;
• each M is independently an ethylenically unsaturated crosslinkable moiety or saturated non-crosslinkable moiety;
• n and m are each independently an integer between 0-3, provided that one of m and n is at least 1;
• and
• k is 1 or 2.