Method for manufacturing electrical contact element for testing electro device and electrical contact element thereby

A method for manufacturing an electrical contact element used to test an electronic device, by defining, on a sacrificial substrate, a trench in which a tip portion is to be formed, forming a first protective film pattern in a manner such that the first protective film pattern delimits a first opened region in which a beam portion is to be formed and which is communicated with the trench, filling a conductive material into the first opened region, and removing the sacrificial substrate and the first protective film pattern to form the electrical contact element having the tip portion and the beam portion, the method comprising the steps of:

• conducting one or more times, after defining the trench, anisotropic etching in the trench in such a way as to increase a depth of the trench and round an inner surface of the trench;
• filling the conductive material into the first opened region of a predetermined thickness delimited on the sacrificial substrate by the first protective layer, to form the tip portion and the beam portion, and then flattening an upper surface of a first resultant product;
• forming a second protective film pattern on the first resultant product having undergone the flattening step, in a manner such that the second protective film pattern delimits a second opened region in which an armrest is to be formed, adjacent to the trench in which the tip portion is to be formed;
• filling the conductive material into the second opened region of a predetermined thickness delimited on the first resultant product by the second protective layer, to form the armrest, and then flattening an upper surface of a second resultant product;
• and
• removing the second protective film pattern, first protective film pattern and sacrificial substrate to complete the electrical contact element having the tip portion, beam portion and armrest.

An electrical contact element used to test an electronic device, comprising:

• a beam portion having a multi-stepped configuration which comprises a first bar-shaped part, a second bar-shaped part connected with the first part and having a width greater than the first part, and a third bar-shaped part connected at one thereof with the second part and having a width greater than the second part, the third part being connected at the other end thereof with an electronic component, through a bump;
• a trench defined on a sacrificial substrate at a position corresponding to a free end of the first part of the beam portion, by conducting one or more times a first isotropic etching process using a first protective film pattern as an etching mask, in a manner such that a bottom surface of the trench is rounded;
• and
• a tip portion formed by applying, after removing the first protective film pattern, a second protective film pattern on the sacrificial substrate, filling a conductive material into the trench, flattening an upper surface of a resultant product, removing the sacrificial substrate and the second protective film pattern by wet etching.

An electrical contact element used to test an electronic device, comprising:

• a beam portion having a zigzagged configuration which comprises a first bar-shaped part connected with an electronic component through a bump, a second zigzagged part connected with the first part and zigzagged one or more times, and a third bar-shaped part connected with the second part;
• a trench defined on a sacrificial substrate at a position corresponding to a free end of the third part of the beam portion, by conducting one or more times a first isotropic etching process using a first protective film pattern as an etching mask, in a manner such that a bottom surface of the trench is rounded;
• and
• a tip portion formed by applying, after removing the first protective film pattern, a second protective film pattern on the sacrificial substrate, filling a conductive material into the trench, flattening an upper surface of a resultant product, removing the sacrificial substrate and the second protective film pattern by wet etching.

An electrical contact element used to test an electronic device, comprising:

• a sacrificial substrate formed, on a surface thereof, with a first photoresist of a predetermined thickness;
• a first opened region defined by patterning the first photoresist, for allowing a tip portion to be formed therein;
• a trench for allowing the tip portion to be formed therein by using a first photoresist pattern as an etching mask, the trench undergoing an anisotropic etching process to round the tip portion, the first photoresist pattern formed on the sacrificial substrate being removed by ashing;
• a zigzagged beam portion zigzagged one or more times and an armrest formed by filling, to a predetermined thickness and through implementing a chemical vapor deposition, physical vapor deposition or plating process, a conductive material for the formation of the tip and beam portions into a second opened region delimited by a second photoresist pattern on the sacrificial substrate, flattening an upper surface of a resultant product, and removing the second photoresist pattern and a third photoresist pattern;
• a post portion formed on a terminal of an electronic component to have a bump of a predetermined size;
• and
• connection means for connecting the post portion with one end of the beam portion opposite to the other end of the beam portion on which the armrest is formed;
• wherein the armrest is formed on an upper surface of a zigzagged part of the beam portion when the sacrificial substrate is removed by wet etching.

An electrical contact element used to test an electronic device, comprising:

• a sacrificial substrate formed, on a surface thereof, with a first photoresist of a predetermined thickness;
• a first opened region defined by patterning the first photoresist, for allowing a tip portion to be formed therein;
• a trench for allowing the tip portion to be formed therein by using a first photoresist pattern as an etching mask, the trench undergoing an anisotropic etching process to round the tip portion, the first photoresist pattern formed on the sacrificial substrate being removed by ashing;
• a zigzagged beam portion zigzagged one or more times and an armrest formed by filling, to a predetermined thickness and through implementing a chemical vapor deposition, physical vapor deposition or plating process, a conductive material for the formation of the tip and beam portions into a second opened region delimited by a second photoresist pattern on the sacrificial substrate, flattening an upper surface of a resultant product, and removing the second photoresist pattern and a third photoresist pattern;
• a post portion formed on a terminal of an electronic component to have a bump of a predetermined size;
• connection means for connecting the post portion with one end of the beam portion opposite to the other end of the beam portion on which the armrest is formed;
• and
• the tip portion being formed on the beam portion when the sacrificial substrate is removed by wet etching;
• wherein the armrest is selectively formed on a zigzagged part of the zigzagged beam portion or a surface of the electronic component facing the zigzagged beam portion.

An electrical contact element used to test an electronic device, comprising:

• a sacrificial substrate formed, on a surface thereof, with a first photoresist of a predetermined thickness;
• a first opened region defined by patterning the first photoresist, for allowing a tip portion to be formed therein;
• a trench for allowing the tip portion to be formed therein by using a first photoresist pattern as an etching mask, the trench undergoing an anisotropic etching process to round the tip portion, the first photoresist pattern formed on the sacrificial substrate being removed by ashing;
• a zigzagged beam portion zigzagged one or more times and an armrest formed by filling, to a predetermined thickness and through implementing a chemical vapor deposition, physical vapor deposition or plating process, a conductive material for the formation of the tip and beam portions into a second opened region delimited by a second photoresist pattern on the sacrificial substrate, flattening an upper surface of a resultant product, and removing the second photoresist pattern and a third photoresist pattern;
• a post portion formed on a terminal of an electronic component to have a bump of a predetermined size;
• and
• connection means for connecting the post portion with one end of the beam portion opposite to the other end of the beam portion on which the armrest is formed;
• wherein, when the sacrificial substrate is removed by wet etching, armrests are respectively formed on a zigzagged part of the zigzagged beam portion and a surface of the electronic component in a manner such that the armrests are spaced apart from each other by a predetermined distance.