Method for improving contact hole patterning
AssigneeToppoly Optoelectronics Corp.
InventorYaw-Ming Tsai
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Abstract
An LCD panel is provided, the LCD panel having a substrate, a conductive layer positioned on the substrate, and a dielectric layer disposed on the surface of the conductive layer. First, a photoresist layer with an opening is formed on the dielectric layer. An etching process is then performed to form a contact hole along the opening. After that, a post treatment process is performed to form a protective layer to reduce damage on the conductive layer when the photoresist layer is stripped.
Claims36
A method for improving contact hole patterning in a liquid crystal display (LCD) panel, the liquid crystal display panel comprising a substrate, a conductive layer positioned on the substrate surface, and a dielectric layer disposed on the conductive layer, the method comprising the following steps:
- forming a photoresist layer on the dielectric layer, the photoresist layer having an opening extending through to the surface of the dielectric layer;
- performing an etching process to remove parts of the dielectric layer along the opening to form a contact hole extending to the surface of the conductive layer;
- performing a post treatment process to form a protective layer;
- and
- stripping the photoresist layer.
A method for improving contact hole patterning in a semiconductor wafer, the semiconductor wafer comprising a substrate, a conductive layer positioned on the substrate surface, and a dielectric layer disposed on the conductive layer, the method comprising the following steps:
- forming a photoresist layer on the dielectric layer, the photoresist layer having an opening extending through to the surface of the dielectric layer;
- performing an etching process to remove parts of the dielectric layer along the opening to form a contact hole extending to the surface of the conductive layer;
- performing a post treatment process to form a protective layer;
- and
- stripping the photoresist layer.
Dependencies are inferred from the claim text.