Modification of circuit features that are interior to a packaged integrated circuit

A parallel design process for integrated circuits, comprising:

• a) while designing an integrated circuit, laying out plural circuit features to be evaluated;
• b) fabricating and packaging a plurality of the integrated circuits;
• c) for a first of the packaged integrated circuits,
• i) identifying a circuit feature that is interior to the packaged integrated circuit, wherein the interior circuit feature is coupled to at least one of the plural circuit features to be evaluated;
• ii) identifying a trimming point on the interior circuit feature using an x-ray inspection system;
• iii) relating coordinates of the trimming point to coordinates of a visible reference marker;
• iv) utilizing the relationship between the visible reference marker and the trimming point to position a cutting tool over the trimming point;
• and
• v) utilizing the cutting tool to make one or more cuts into the first of the packaged integrated circuits, until the interior circuit feature has been acceptably modified at the trimming point;
• and
• d) comparing operation of the first of the packaged integrated circuits to operation of a second of the packaged integrated circuits.

A parallel design process for integrated circuits, comprising:

• a) while designing a package for an integrated circuit, laying out plural package circuit features to be evaluated;
• b) fabricating and packaging a plurality of the integrated circuits;
• c) for a first of the packaged integrated circuits,
• i) identifying one of the plural package circuit features to be modified;
• ii) identifying a trimming point on the identified package circuit feature, using an x-ray inspection system;
• iii) relating coordinates of the trimming point to coordinates of a visible reference marker;
• iv) utilizing the relationship between the visible reference marker and the trimming point to position a cutting tool over the trimming point;
• and
• v) utilizing the cutting tool to make one or more cuts into the first of the packaged integrated circuits, until the identified package circuit feature has been acceptably modified at the trimming point;
• and
• d) comparing operation of the first of the packaged integrated circuits to operation of a second of the packaged integrated circuits.

A method for tuning a packaged integrated circuit, comprising:

• a) incorporating into a packaged integrated circuit design, at least one tunable circuit feature;
• b) fabricating a packaged integrated circuit in accordance with said packaged integrated circuit design;
• c) identifying a trimming point on the tunable circuit feature of said packaged integrated circuit, using an x-ray inspection system;
• d) relating coordinates of the trimming point to coordinates of a visible reference marker;
• e) utilizing the relationship between the visible reference marker and the trimming point to position a cutting tool over the trimming point;
• and
• f) utilizing the cutting tool to make one or more cuts into the packaged integrated circuit, until the tunable circuit feature has been acceptably modified at the trimming point.

A method for producing batches of packaged integrated circuits with differing characteristics, comprising:

• a) designing an integrated circuit and package therefor that incorporate at least one optional circuit feature;
• b) fabricating a plurality of packaged integrated circuits as designed;
• c) dividing the plurality of packaged integrated circuits into at least two batches, and for the packaged integrated circuits of a first batch,
• i) identifying a circuit feature that enables one of the optional circuit features, wherein the circuit feature is interior to the packaged integrated circuits of the first batch;
• ii) identifying a trimming point on the interior circuit feature using an x-ray inspection system;
• iii) relating coordinates of the trimming point to coordinates of a visible reference marker;
• iv) utilizing the relationship between the visible reference marker and the trimming point to position a cutting tool over the trimming point;
• and
• v) utilizing the cutting tool to make one or more cuts into the packaged integrated circuits of the first batch, until the interior circuit feature has been acceptably modified in at least some of the packaged integrated circuits of the first batch, thereby creating a batch of packaged integrated circuits that differs from other batches of packaged integrated circuits.