Semiconductor memory module
AssigneeMitsubishi Denki Kabushiki Kaisha
InventorYoshito Nakaoka
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AssigneeMitsubishi Denki Kabushiki Kaisha
InventorYoshito Nakaoka
Estimating the term…
A bare chip includes a first semiconductor storage part and a second semiconductor storage part, formed in the stage of a wafer serving as a semiconductor material, capable of storing data independently of each other, and an electric wire serving as a semiconductor storage part employment/nonemployment selection circuit setting each of the first semiconductor storage part and the second semiconductor storage part in either a mode capable of inputting/outputting data or a mode incapable of inputting/outputting the data. Thus obtained is a semiconductor memory module formed by a plurality of bare chips integrally coated with molding resin, having a function of replacing a bare chip detected as defective with a spare chip.
A semiconductor memory module having a plurality of semiconductor chip assemblies, each including a plate semiconductor material formed by combining a plurality of semiconductor chips with each other, mounted on a module substrate, wherein
Dependencies are inferred from the claim text.