Semiconductor device having a step-like section on the back side of the substrate, and method for manufacturing the same

A semiconductor device comprising:

• a semiconductor substrate having a first main surface having circuit elements formed thereon, a second main surface substantially opposite to the first main surface, and a plurality of side faces provided between the first main surface and the second main surface;
• and a plurality of external terminals formed over the first main surface and respectively electrically connected to the circuit elements,
• wherein the semiconductor substrate has a first portion in which the distance from the first main surface to the second main surface is a first distance, and a second portion in which the distance from the first main surface to the second main surface is a second distance shorter than the first distance between a first side face of the plurality of side faces and a second side face opposite to the first side face.

A semiconductor device comprising:

• a semiconductor substrate having a first main surface having circuit elements formed thereon, a second main surface substantially opposite to the first main surface, and a plurality of side faces provided between the first main surface and the second main surface;
• and a plurality of external terminals formed over the first main surface and respectively electrically connected to the circuit elements,
• wherein a steplike section extending from a first side face of the plurality of side faces to a second side face opposite to the first side face is formed in the second main surface, and the thickness of the semiconductor substrate is a first thickness at the second main surface excluding the steplike section and is a second thickness thinner than the first thickness at the steplike section.

A semiconductor device comprising:

• a semiconductor substrate having a first main surface having circuit elements formed thereon, a second main surface substantially opposite to the first main surface, and a plurality of side faces provided between the first main surface and the second main surface;
• and a plurality of external terminals formed over the first main surface and respectively electrically connected to the circuit elements,
• wherein the second main surface has a first portion which extends from a first side face of the plurality of side faces to a second side face opposite to the first side face and whose roughness is coarser than that of the second main surface excluding the first portion.