Support assembly for an integrated circuit package having solder columns
AssigneeHewlett-Packard Development Company, L.P.
InventorsJeffrey L. Deeney, Laszlo Nobi, Joseph D. Dutson
Life of this patent
Estimating the term…
Abstract
A support assembly for supporting an integrated circuit package with an array of solder columns extending from a bottom surface of the integrated circuit package to a circuit board preferably includes: a pair of shims for supporting the integrated circuit package, the shims being positioned along opposite edges of the integrated circuit package and placed between and abutting the integrated circuit package and the circuit board; and a retention clip for aligning and securing in place the pair of shims.
Claims30
A support assembly for supporting an integrated circuit package with an array of solder columns extending from a bottom surface of said integrated circuit package to a circuit board, said support assembly comprising:
- a pair of shims for supporting said integrated circuit package, said shims being positioned along opposite edges of said integrated circuit package and placed between and abutting said integrated circuit package and said circuit board;
- and
- a retention clip for aligning and securing in place said pair of shims.
A method of supporting an integrated circuit package with an array of solder columns extending from a bottom surface of said integrated circuit package to a circuit board, said method comprising:
- positioning along opposite edges of said integrated circuit package a pair of shims, said shims being placed between and abutting said integrated circuit package and said circuit board;
- and
- attaching a retention clip to said pair of shims.
A system for supporting an integrated circuit package with an array of solder columns extending from a bottom surface of said integrated circuit package to a circuit board, said system comprising:
- means for supporting said integrated circuit package, said means being placed between and abutting said integrated circuit package and said circuit board;
- and
- means for retaining said means for supporting said integrated circuit package.
Dependencies are inferred from the claim text.