MEMS control chip integration

A MEMS device array package suitably adapted for control-chip integration, comprising:

• a device substrate comprising a plurality of MEMS device elements and a plurality of first interconnect pads, said first interconnect pads communicably connected to said MEMS device elements;
• a control-chip substrate comprising a plurality of control elements suitably adapted for controlling said MEMS device elements, said control-chip substrate further comprising a plurality of second interconnect pads communicably connected to said control elements, said control-chip substrate further comprising a plurality of lid regions, said control-chip lid regions disposed substantially over said device substrate, said control-chip substrate substantially affixed to said device substrate, said control-chip lid regions effectively enclosing said MEMS device elements;
• and
• said first interconnect pads suitably adapted for substantial engagement with said second interconnect pads to communicably connect said control elements to said MEMS device elements.

A MEMS device package suitably adapted for control-chip integration, comprising:

• a device substrate comprising a MEMS device element and a recess for receiving a control-chip die, said recess substantially disposed on a surface of said device substrate substantially opposing said MEMS device element;
• a control-chip comprising a control element for controlling said MEMS device element, said control-chip substantially disposed within said control-chip die recess;
• said device substrate further comprising an interconnect via for communicably connecting said MEMS device element to said control element;
• and
• means for substantially enclosing said MEMS device element from the external environment.

A MEMS device array package suitably adapted for control-chip integration, comprising:

• a device substrate comprising a plurality of MEMS device elements and a plurality of recesses for receiving a plurality of control-chip dies, said recesses substantially disposed on a surface of said device substrate substantially opposing said plurality of MEMS device elements;
• a plurality of control-chips comprising a plurality of control elements for controlling said plurality of MEMS device elements, said plurality of control-chips substantially disposed within said plurality of control-chip die recesses;
• said device substrate further comprising a plurality of interconnect vias for communicably connecting said plurality of MEMS device elements to said plurality of control elements;
• and
• said MEMS device elements substantially enclosed from the external environment.