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US 2004/0016983 A1Published application
Semiconductor device and method for manufacturing the same
AssigneeFUJIFILM Corporation
InventorTakeshi Misawa
Life of this patent
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Abstract
The semiconductor device according to this invention is characterized by a package structure of a semiconductor substrate 100 equipped with a photoelectric converting portion, wherein a light-shading means 104 is arranged in an area corresponding to at least the photoelectric converting portion on the side of the rear surface of the semiconductor substrate.
Claims10
A semiconductor device comprising:
- a semiconductor substrate on which a photoelectric converting portion is formed;
- a package which comprises at least a light-shading means for shading an incoming light to said photoelectric converting portion, wherein
- said light-shading means is formed at an are a corresponding to at least the photoelectric converting portion, said area being on the side of the rear surface of the semiconductor substrate.
A method for manufacturing a semiconductor device comprising the steps of:
- a forming step for forming a plurality of semiconductor devices on the front surface of a semiconductor substrate;
- a bonding step for bonding a wiring board on the rear surface of said semiconductor substrate;
- a separating step for separating a bonding structure obtained by bonding into semiconductor devices, and
- a grinding step for forming rough surface on the rear surface of the semiconductor substrate.
1 more element
A method for manufacturing a semiconductor device comprising the steps of:
- a forming step for forming a plurality of semiconductor devices on the front surface of a semiconductor substrate;
- a bonding step for bonding a wiring board on the rear surface of said semiconductor substrate through light-shading adhesive;
- and a separating step for separating a bonding structure obtained by bonding into semiconductor devices.
Dependencies are inferred from the claim text.