Semiconductor device, image scanning unit including the semiconductor device, and image forming apparatus including the image scanning unit

A semiconductor device comprising:

• a semiconductor chip including a functional surface;
• a substrate configured to support the semiconductor chip, the substrate opposing the functional surface of the semiconductor chip at a space formed between the substrate and the functional surface;
• a power supplying device configured to supply electric power to the semiconductor chip while being electrically connected to a part of the functional surface of the semiconductor chip, wherein the power supplying device is interposed between the functional surface of the semiconductor chip and the substrate, and the power supplying device is in intimate contact with the substrate;
• a fixing member configured to fix the semiconductor chip to the substrate, the fixing member being disposed beside a part of the functional surface of the semiconductor chip other than a part of the functional surface of the semiconductor chip connected to the power supplying device;
• and
• a sealing member configured to seal the space formed between the substrate and the functional surface of the semiconductor chip other than a space formed between the substrate and the functional surface of the semiconductor chip that are fixed to each other through the fixing member,
• wherein the sealing member has greater elasticity than the fixing member.

A semiconductor device comprising:

• a semiconductor chip including a functional surface;
• supporting means for supporting the semiconductor chip, the supporting means opposing the functional surface of the semiconductor chip at a space formed between the supporting means and the functional surface;
• power supplying means for supplying electric power to the semiconductor chip while being electrically connected to a part of the functional surface of the semiconductor chip, wherein the power supplying means is interposed between the functional surface of the semiconductor chip and the supporting means, and the power supplying means is in close proximity with the supporting means;
• fixing means for fixing the semiconductor chip to the supporting means, the fixing means being disposed beside a part of the functional surface of the semiconductor chip other than a part of the functional surface of the semiconductor chip connected to the power supplying means;
• and
• sealing means for sealing the space formed between the supporting means and the functional surface of the semiconductor chip other than a space formed between the supporting means and the functional surface of the semiconductor chip that are fixed to each other through the fixing means and other than a gap formed between the power supplying means and the supporting means,
• wherein the sealing means has greater elasticity than the fixing means.