Method of boosting wafer cleaning efficiency and increasing process yield
AssigneeMacronix International Co., Ltd.
InventorsSzu-Tsun Ma, Kent Kuohua Chang
Life of this patent
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Abstract
A method of boosting wafer-cleaning efficiency and increasing process yield. Different types of process particles are deposited on a test wafer. The test wafer is cleaned in a cleaning operation. The test wafer is scanned to determine the types of process particles that are completely removed and the types of process particles that remain over the test wafer. The results of wafer scanning are used to provide an assessment of the efficiency of the cleaning operation. Operation parameters of the cleaning operation are adjusted to maximize the wafer-cleaning efficiency.
Claims20
A method of increasing wafer-cleaning efficiency, comprising the steps of:
- depositing different types of process particles on a test wafer;
- conducting a cleaning operation to remove process particles from the test wafer;
- scanning the test wafer to determine the type of process particles completely removed from the test wafer and the type of process particles retained on the test wafer;
- producing an assessment of the wafer-cleaning operation according to the results obtained by scanning the test wafer for process particles remaining on the test wafer;
- and
- adjusting the operating parameters of the cleaning operation to boost wafer-cleaning efficiency.
A method of increasing process yield, comprising the steps of:
- depositing different types of process particles on a test wafer;
- scanning the process particles on the test wafer to simulate the types of process particles produced in an actual processing operation;
- determining if the process particles have any adverse effect on a subsequently formed device according to the results of the scanning operation;
- and
- increasing the process yield of the actual processing operation by modifying the operating parameters of the actual processing operation if the process particles have some adverse effects on the device.
Dependencies are inferred from the claim text.