Dicing method for micro electro mechanical system chip

Abstract

A dicing method for a micro electro mechanical system chip, in which a high yield and productivity of chips can be accomplished, resulting from preventing damage to microstructures during a dicing process by using a photoresist or filler. The dicing method comprises the steps of spraying a liquid photoresist as a protectant of microstructures on a wafer on which the microstructures are installed, and coating the whole surface of the wafer with the photoresist (first step); heat treating the coated wafer at a predetermined temperature for a certain time to remove residual water in the sprayed photoresist and to cure the sprayed photoresist (second step); dicing the heat treated wafer (third step); and removing the photoresist (fourth step).

Dependencies are inferred from the claim text.