Device and method for automatically determining the surface quality of a bonding interface between two wafers
AssigneeS.O.I. Tec Silicon on Insulator Technologies
InventorsChristophe Malville, Frederic Metral
Life of this patent
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Abstract
The invention relates to a device and method for automatically determining the surface quality of a bonding interface between two wafers. The device includes a detector for automatically detecting a bonding wave at a predetermined measuring site to determine when bonding occurs at the measuring site, and a processing unit for automatically calculating the bonding speed based on a location of the measuring site and at least one other predetermined site.
Claims23
A device for automatically determining the surface quality of a bonding interface between two wafers comprising:
- a detector for automatically detecting a bonding wave at a predetermined measuring site to determine when bonding occurs at the measuring site;
- and
- means for automatically calculating the bonding speed based on a location of the measuring site and at least one other predetermined site to determine the surface quality of the bonding interface.
A method for automatically determining the surface quality of a bonding interface between two wafers comprising:
- automatically detecting a bonding wave at a predetermined measuring site to determine when bonding occurs at the measuring site;
- and
- automatically calculating a bonding speed based on a location of the measuring site and at least one other predetermined site to determine the surface quality of the bonding interface.
Dependencies are inferred from the claim text.