Retaining assembly for heat sink

A retaining module for fastening a heat sink to an electronic device, the retaining module comprising:

• a base defining an opening in a center thereof for extension of the electronic device;
• four sidewalls arranged at four sides of the base respectively for surrounding the heat sink and the electronic device;
• and
• at least one resilient member arranged on an interior face of at least one of the sidewalls for pressing the heat sink thereby preventing the heat sink from moving in lateral direction relative to the electronic device.

A retaining assembly comprising:

• a printed circuit board;
• an electronic package assembly mounted on the printed circuit board;
• a retaining module mounted on the printed circuit board and surrounding the electronic package assembly;
• a heat sink having a base seated upon the electronic package assembly and surrounded by the retaining module;
• at least one clip fastening to the retaining module and pressing the heat sink downwardly toward the electronic package assembly;
• and
• a plurality of resilient members mounted on an interior periphery of the retaining module;
• wherein
• each of said resilient members includes an upward slanted guide portion for resiliently guidably loading the heat sink into the retaining module, and an offset pressing portion located below the guide portion and horizontally inwardly pressing a corresponding side wall of the base of the heat sink.