Silicon wafer based macroscopic mirror for wide angle scanning applications

A method of making a macroscopic mirror for wide angle scanning applications comprising:

• preparing a silicon wafer by polishing one side to a predetermined flatness and etching the other side to a predetermined roughness;
• cutting a substrate section from the prepared silicon wafer to a predetermined shape and macroscopic size;
• and
• applying a plurality of layers, including a layer of reflective medium, on the flat, polished surface of said substrate section in such a manner to minimize flexural distortion of said flat surface.

A mirror system for wide angle scanning a radiation beam, said system comprising:

• a macroscopic mirror comprising:
• a silicon substrate section of a predetermined shape and macroscopic size cut from a silicon wafer, said substrate section comprising a flat, polished surface side and an etched, rough surface side;
• and
• a plurality of layers, including a layer of reflective medium, disposed on the flat, polished surface of said substrate section in such a manner to minimize flexural distortion of said flat surface;
• a mirror drive mechanism including a plurality of supporting arms;
• and
• wherein the rough surface side of said macroscopic mirror being bonded to said supporting arms of the drive mechanism, said mirror drive mechanism for scanning said macroscopic mirror at a predetermined scanning rate in at least one plane of rotation.