Heat-dissipating device
OwnerChin-Kuang Luoinventor
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Abstract
A heat-dissipating device includes a thermal superconducting body, a fan unit and a guide pipe. The superconducting body includes a hollow heat transfer body adapted to be disposed on a heat-generating component of an electronic device. The heat transfer body is made of a heat-conducting material and is configured to confine at least one air channel. The fan unit is disposed to draw hot air away from the heat transfer body. The guide pipe has an inlet port in fluid communication with the heat transfer body for collecting hot air from the heat transfer body, an outlet port in fluid communication with the fan unit, and an intermediate pipe portion interconnecting the inlet and outlet ports for guiding the hot air from the inlet port to the outlet port for extraction by the fan unit.
Claims9
A heat-dissipating device comprising:
- a thermal superconducting body including a hollow heat transfer body adapted to be disposed on a heat-generating component of an electronic device, said heat transfer body being made of a heat-conducting material and being configured to confine at least one air channel;
- a fan unit disposed to draw hot air away from said heat transfer body;
- and
- a guide pipe having an inlet port in fluid communication with said heat transfer body for collecting hot air from said heat transfer body, an outlet port in fluid communication with said fan unit, and an intermediate pipe portion interconnecting said inlet and outlet ports for guiding the hot air from said inlet port to said outlet port for extraction by said fan unit.
Dependencies are inferred from the claim text.