Biocompatible bonding method and electronics package suitable for implantation

An implantable device comprising:

• a substrate containing at least one electrically conductive feedthrough attached to an electrically conductive routing on at least one side of said substrate;
• a flexible assembly comprised of a first flexible electrically insulating substrate, a second flexible electrically insulating substrate, and at least one bond pad between said first and said second flexible electrically insulating substrates;
• said first flexible electrically insulating substrate defining at least one hole that passes through said first flexible electrically insulating substrate, wherein said hole is aligned with said routing;
• said second flexible electrically insulating substrate defining at least one hole that passes through said first flexible electrically insulating substrate, wherein said hole is aligned with said routing;
• said at least one bond pad defining a hole therethrough, wherein said hole is aligned with said routing;
• and
• wherein said substrate and said flexible assembly are bonded together with a deposited rivet.

A method of electrochemically depositing a platinum layer, comprising the steps of:

• providing a substrate;
• electroplating the surface of a conductive substrate at a rate such that the particles of platinum form on the conductive substrate faster than necessary to form shiny platinum and slower than necessary to form platinum gray;
• aligning an anode and a cathode;
• immersing said anode and cathode in an electrochemical bath;
• and
• plating said platinum layer.