Metal oxide powder for high precision polishing and method of preparation thereof
AssigneeSamsung Corning Co., Ltd.
InventorsHyukjin Kwon, Myungho Ahn, Youngkwon Joung, Inyeon Lee
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AssigneeSamsung Corning Co., Ltd.
InventorsHyukjin Kwon, Myungho Ahn, Youngkwon Joung, Inyeon Lee
Estimating the term…
The present invention relates to a metal oxide powder for high precision polishing and prepartion thereof, comprising aggregates formed by cohesion of primary particles, which has a cohesive degree (α) of 1.1 to 2.0 and a cohesive scale (β) of 3 to 10, the cohesive degree (α) and the cohesive scale (β) being defined by formula (I) and formula (II), respectively: α=6/(S×ρ×d(XRD)) (I) β=weight average particle diameter/d(XRD) (II) wherein, S is the specific surface area of the powder; ρ, the density; and d(XRD), the particle diameter of the powder determined by X-ray diffraction analysis. In accordance with the present invention, it is possible to provide a high polishing speed and reduce scratches.
A metal oxide powder comprising aggregates formed by cohesion of primary particles, which has a cohesive degree (α) of 1.1 to 2.0 and a cohesive scale (β) of 3 to 10, the cohesive degree (α) and the cohesive scale (β) being defined by formula (I) and formula (II), respectively:
Dependencies are inferred from the claim text.