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US 2003/0227751 A1Published application
Multichip package
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorMeng Jen Wang
Life of this patent
Estimating the term…
Abstract
A multichip package mainly includes a substrate, a first chip disposed on the lower surface of the substrate by flip-chip bonding, at least one second chip and a heat spreader disposed on the upper surface of the substrate. A plurality of solder balls are formed at the periphery of the first chip on the lower surface of the substrate wherein the solder balls electrically connected to the first chip or the second chip.
Claims29
A multichip package comprising:
- a substrate having opposing upper and lower surfaces;
- a first chip disposed on the lower surface of the substrate by flip-chip bonding, wherein the upper surface of the substrate has a projective area corresponding to the first chip;
- at least one second chip disposed on the upper surface of the substrate;
- a plurality of solder balls formed at the periphery of the first chip on the lower surface of the substrate wherein some of the solder balls are electrically connected to the fist chip and the other solder balls are electrically connected to the second chip;
- and
- a heat spreader being disposed on the upper surface and covering the projective area.
3 more elements
A multichip package comprising:
- a substrate having opposing upper and lower surfaces;
- a first chip disposed on the lower surface of the substrate by flip-chip bonding;
- at least one second chip disposed on the upper surface of the substrate;
- a plurality of solder balls formed at the periphery of the first chip on the lower surface of the substrate wherein some of the solder balls are electrically connected to the fist chip and the other solder balls are electrically connected to the second chip;
- and
- a heat spreader disposed on the upper surface.
3 more elements
Dependencies are inferred from the claim text.