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US 2003/0227091 A1Published application
Plating metal caps on conductive interconnect for wirebonding
OwnerNishant Sinha, Dinesh Choprainventors
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OwnerNishant Sinha, Dinesh Choprainventors
Estimating the term…
A method of forming a conductive interconnect, preferably a copper interconnect, comprising a metal cap formed thereover. The metal cap is preferably comprises silver, gold, cobalt, nickel-tungsten, cobalt-tungsten, silver-tungsten or nickel. The conductive interconnect is fabricated by forming a substrate having a trench formed therein, forming a barrier layer over the substrate and within the trench, forming a conductive layer over the barrier layer and within the trench, planarizing the conductive layer to an upper surface of the barrier layer, recessing the conductive layer below an upper surface of the barrier layer, and forming a metal layer over the conductive layer via electroplating.
A method of plating a conductive interconnect of an integrated circuit, said method comprising:
A method of fabricating a metal cap over a copper interconnect, comprising the steps of:
A method of forming a copper interconnect for a semiconductor circuit, comprising the steps of:
A processor-based system comprising:
A conductive interconnect of an integrated circuit comprising:
A conductive interconnect of an integrated circuit comprising:
A structure for wirebonding comprising:
A structure for wirebonding comprising:
A structure for wirebonding comprising:
Dependencies are inferred from the claim text.