Back to results
US 2003/0227073 A1Published application
Lead frame and manufacturing method thereof and a semiconductor device
AssigneeFujitsu Limited
InventorTakahiro Yurino
Life of this patent
Estimating the term…
Abstract
In a semiconductor device, a lead frame made of a copper alloy prevents exfoliation occurring near the surface of the lead frame. A copper oxide layer is formed on the base material made of a copper alloy by immersing the base material into a solution of a strong oxidizer. The copper oxide layer serves as an outermost layer and consists of a copper oxide other than a copper oxide in the form of needle crystals.
Claims6
A lead frame comprising:
- a base material made of a copper alloy;
- and
- a copper oxide layer formed by contacting the lead frame with a solution of a strong oxidizer, the copper oxide layer serving as an outermost layer and consisting of a copper oxide other than a copper oxide in the form of needle crystals.
A manufacturing method of a lead frame, comprising:
- configuring a base material made of a copper alloy into a predetermined pattern;
- applying plating to a part of the base material;
- and
- forming a copper oxide layer as an outermost layer on a surface of the base material by immersing the base material into a solution of a strong oxidizer, the copper oxide layer consisting of a copper oxide other than a copper oxide in the form of needle crystals.
1 more element
A semiconductor device comprising:
- a lead frame having a copper oxide layer formed on a base material made of a copper alloy, the copper oxide layer formed by contacting the lead frame with a solution of a strong oxidizer and serving as an outermost layer, the copper oxide layer consisting of a copper oxide other than a copper oxide in the form of needle crystals;
- a semiconductor element mounted on a predetermined portion of the lead frame;
- and
- a seal resin encapsulating the semiconductor device.
1 more element
Dependencies are inferred from the claim text.