Microelectronic packaging and methods for thermally protecting package interconnects and components

A substrate for use in manufacturing microelectronic packages, comprising:

• a land side and a die side opposite the land side, the land side comprising a plurality of interconnect land pad arrays separated by cut paths, each interconnect land-pad array comprising a plurality of interconnect land pads;
• an interconnect coupled to each of the interconnect land pads with reflowable electrically conductive interconnect material;
• and
• a layer of curable material covering the interconnect material about the interconnects, the curable material, once cured to a hardened state, adapted to contain the interconnect material about the interconnects at temperatures exceeding the melting temperature of the interconnect material and to support the interconnects at elevated temperatures.

A method for assembling a microelectronic package, comprising:

• providing a carrier substrate comprising an array of interconnects coupled to a land side with reflowable electrically conductive interconnect material;
• applying a layer of curable material on the interconnect material about the interconnects, wherein the curable material, once cured to a solid state, is capable of withstanding temperatures exceeding the melting temperature of the interconnect material and supporting the interconnects at elevated temperature;
• and
• curing the curable material.

A method for assembling a microelectronic package, comprising:

• providing a microelectronic die having an array of bond pads on an active side;
• applying reflowable electrically conductive interconnect material to each of the bond pads;
• providing a carrier substrate having a die side and a land side opposite the die side, the die side comprising an array of die land-pads in complimentary relationship with the bond pads, the land side comprising an array of interconnect land-pads;
• aligning and positioning the die on the die side of the carrier substrate such that the bonds pads with interconnect material abuts their respective die land-pads;
• coupling the die to the carrier substrate using an elevated temperature reflow process such that the interconnect material softens and/or melts and upon cooling couples with the die land-pads providing an electrical and structural connection between the bond pads and the die land pads;
• coupling an interconnect to each interconnect land-pad using reflowable electrically conductive interconnect material in a reflow process;
• applying a layer of curable material to the interconnect material about the interconnects wherein the curable material, once cured to a solid state, is capable of withstanding temperatures exceeding the melting temperature of the interconnect material and supporting the interconnects at elevated temperature;
• and
• curing the curable material.