Method for making a financial transaction card with embedded electronic circuitry
AssigneeLensCard U.S., LLC
InventorAlan Finkelstein
Life of this patent
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Abstract
Financial transaction and similar cards are fabricated with a split core adapted to received embedded electronic circuitry. The card core has two or more laminated layers. The cavity is milled into one or more of the layers to receive the electronic circuitry. The core layers are then laminated together, along with protective overlays. Alternative fabrication methods include co-extrusion and injection molding.
Claims11
A method of constructing a card with embedded electronic circuitry comprising:
- printing first card graphics on a first surface of a first core member;
- printing second card graphics on a first surface of a second core member;
- milling corresponding cavities in a second surface of the first core member and a second surface of the second core member;
- installing electronic components within the corresponding cavities;
- aligning the second surface of the first core member with the second surface of the second core member;
- placing a first overlay over the first surface of the first core member;
- placing a second overlay over the first surface of the second core member;
- laminating together the first overlay, the first core member, the second core member and the second overlay.
A method of constructing a card with embedded electronic circuitry comprising:
- printing first card graphics on a first surface of a first core member;
- printing second card graphics on a first surface of a second core member;
- laminating a first overlay to the first surface of the first core member;
- laminating a second overlay to the first surface of the second core member;
- milling a cavity in a second surface of the first core member;
- installing electronic components in the cavity;
- aligning the second surface of the first core member with a second surface of the second core member;
- laminating together the first and second core members.
A method of constructing a card with embedded electronic circuitry comprising:
- milling a first cavity in a first surface of a first core member;
- milling a second cavity in a first surface of a second core member;
- installing electronic components within a space defined by the first and second cavities;
- aligning the first surface of the first core member with the first surface of the second core member;
- laminating together the first and second core members;
- reducing the laminated first and second core members to a thickness of less than 30 mils.
Dependencies are inferred from the claim text.