Methods and apparatus for electrochemical-mechanical processing of microelectronic workpieces

An apparatus for electrochemical-mechanical processing of microelectronic workpieces, comprising:

• a workpiece holder configured to receive a microelectronic workpiece;
• a workpiece electrode configured to contact a processing side of the workpiece when the workpiece is received in the workpiece holder;
• a first remote electrode and a second remote electrode, wherein the first and second remote electrodes are juxtaposed to the workpiece holder to be spaced apart from the processing side of the workpiece when the workpiece is received in the workpiece holder;
• an AC power supply;
• a DC power supply;
• and
• a switching assembly coupled to the workpiece electrode, the first remote electrode, the second remote electrode, the AC power supply, and the DC power supply, wherein the switching assembly is configured to selectively couple the AC power supply and/or the DC power supply to the workpiece electrode, the first remote electrode, and/or the second remote electrode.

An apparatus for electrochemical-mechanical processing of microelectronic workpieces, comprising:

• a workpiece holder configured to receive a microelectronic workpiece;
• a first electrode configured to contact a processing side of the workpiece when the workpiece is received in the workpiece holder;
• a second electrode and a third electrode, the second and third electrodes being remote electrodes that are spaced apart from the workpiece holder;
• a mechanical medium between the workpiece holder and each of the second and third electrodes;
• an AC power supply;
• a DC power supply;
• and
• a switching assembly coupled to the first electrode, second electrode, third electrode, AC power supply, and the DC power supply, wherein the switching assembly is configured to selectively couple the AC power supply and/or the DC power supply to the first, second, and/or third electrodes.

An apparatus for electrochemical-mechanical processing of microelectronic workpieces, comprising:

• a workpiece holder configured to receive a microelectronic workpiece;
• a workpiece electrode configured to contact a processing side of the workpiece when the workpiece is received in the workpiece holder;
• a first remote electrode and a second remote electrode, the first and second remote electrodes being spaced apart from the workpiece holder;
• a mechanical medium between the workpiece holder and each of the first and second remote electrodes;
• an AC power supply;
• a DC power supply;
• and
• a switching assembly coupled to the workpiece electrode, first remote electrode, second remote electrode, AC power supply, and the DC power supply;
• and
• a controller coupled to the switching assembly, the controller including a computer operable medium containing instructions to operate the switching assembly according to a process including (a) coupling the workpiece electrode and at least one of the first and second remote electrodes to the DC power supply, and/or (b) coupling the first and second remote electrodes to the AC power supply.

An apparatus for electrochemical-mechanical processing of microelectronic workpieces, comprising:

• a workpiece holder configured to receive a microelectronic workpiece;
• a workpiece electrode configured to contact a processing side of the workpiece when the workpiece is received in the workpiece holder;
• a first remote electrode and a second remote electrode, the first and second remote electrodes being spaced apart from the workpiece holder;
• a mechanical medium between the workpiece holder and each of the first and second remote electrodes;
• an AC power supply;
• a DC power supply;
• and
• a switching assembly coupled to the workpiece electrode, first remote electrode, second remote electrode, AC power supply, and the DC power supply, wherein the switching assembly is configured to selectively couple the workpiece electrode and at least one of the first and/or second remote electrodes to the DC power supply, and further wherein the switching assembly is configured to selectively couple at least the first and second remote electrodes to the AC power supply.

An apparatus for electrochemical-mechanical processing of microelectronic workpieces, comprising:

• a workpiece holder configured to receive a microelectronic workpiece;
• a workpiece electrode carried by the workpiece holder, the workpiece electrode being configured to contact a processing side of the workpiece when the workpiece is received in the workpiece holder;
• a material removal device including an electrode assembly facing the workpiece holder, a first remote electrode carried by the electrode assembly, a second remote electrode carried by the electrode assembly, and a mechanical medium carried by the first and second remote electrodes, wherein the first and second remote electrodes are spaced apart from the workpiece holder;
• an AC power supply;
• a DC power supply;
• and
• a switching assembly coupled to the workpiece electrode, first remote electrode, second remote electrode, AC power supply, and the DC power supply, wherein the switching assembly is configured to selectively couple the AC power supply and/or the DC power supply to the workpiece electrode, the first remote electrode, and/or the second remote electrode.

An apparatus for electrochemical-mechanical processing of microelectronic workpieces, comprising:

• a workpiece holder configured to receive a microelectronic workpiece;
• a workpiece electrode carried by the workpiece holder, the workpiece electrode being configured to contact a processing side of the workpiece when the workpiece is received in the workpiece holder;
• a material removal device including an electrode assembly facing the workpiece holder, a first remote electrode carried by the electrode assembly, a second remote electrode carried by the electrode assembly, and a mechanical medium carried by the first and second remote electrodes, wherein the electrode assembly is moveable to move the first and second remote electrodes relative to the workpiece holder;
• an AC power supply;
• a DC power supply;
• and
• a switching assembly coupled to the workpiece electrode, first remote electrode, second remote electrode, AC power supply, and the DC power supply, wherein the switching assembly is configured to selectively couple the AC power supply and/or the DC power supply to the workpiece electrode, the first remote electrode, and/or the second remote electrode.

A method of electrochemical-mechanical processing of microelectronic workpieces, comprising:

• contacting a processing side of a microelectronic workpiece with an electrolytic solution;
• applying a direct electrical current to a workpiece electrode contacting the processing side of the workpiece and a first remote electrode, the workpiece electrode and the first remote electrode being in electrical communication with the electrolytic solution;
• applying an alternating current to the first remote electrode and a second remote electrode, the first and second remote electrodes being in electrical communication with the electrolytic solution;
• and
• contacting the processing side of the workpiece with a mechanical medium at least while applying the alternating current to the first and second remote electrodes.

A method of electrochemical-mechanical processing of microelectronic workpieces, comprising:

• contacting a processing side of a microelectronic workpiece with an electrolytic solution;
• applying a direct electrical current to a workpiece electrode contacting the processing side of the workpiece and at least one of a first remote electrode and/or a second remote electrode, the workpiece electrode, the first remote electrode, and the second remote electrode being in electrical communication with the electrolytic solution;
• applying an alternating current to the first and second remote electrodes;
• and
• contacting the processing side of the workpiece with a mechanical medium at least while applying the alternating current to the first and second remote electrodes.

A method of electrochemical-mechanical processing of microelectronic workpieces, comprising:

• contacting a processing side of a microelectronic workpiece with an electrolytic solution;
• applying a direct electrical current to a workpiece electrode in contact with the processing side of the workpiece and at least one of a first remote electrode and/or a second remote electrode, wherein the workpiece electrode, the first remote electrode, and the second remote electrode are in electrical communication with the electrolytic solution;
• and
• applying an alternating current to the first and second remote electrodes while applying the direct current.

A method of electrochemical-mechanical processing of microelectronic workpieces, comprising:

• contacting a processing side of a microelectronic workpiece with an electrolytic solution;
• applying a direct electrical current to a workpiece electrode contacting the processing side of the workpiece and at least one of a first remote electrode and/or a second remote electrode, the workpiece electrode, the first remote electrode, and the second remote electrode being in electrical communication with the electrolytic solution;
• applying an alternating current to the first and second remote electrodes while applying the direct current;
• and
• moving at least one of the microelectronic workpiece and/or the first and second remote electrodes relative to each other while applying the direct current and the alternating current so that the first and second remote electrodes have a higher dwell time at a first region of the workpiece than at a second region of the workpiece.

A method of electrochemical-mechanical processing of microelectronic workpieces, comprising:

• contacting a processing side of a microelectronic workpiece with an electrolytic solution;
• applying a direct electrical current to a workpiece electrode that is in contact with the processing side of the workpiece and at least one of a first remote electrode and/or a second remote electrode, the workpiece electrode, the first remote electrode, and the second remote electrode being in electrical communication with the electrolytic solution;
• applying an alternating current to the first and second remote electrodes while applying the direct current;
• and
• moving at least one of the microelectronic workpiece and/or the first and second remote electrodes relative to each other while applying the direct current and the alternating current so that the first and second remote electrodes have a higher dwell time at regions of the workpiece having a thicker layer of plated material.