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US 2003/0225475 A1Published application
Method and system for estimating microelectronic fabrication product yield
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsYun-Wei Liao, Regina Ka, Mei-Ling Chu
Life of this patent
Estimating the term…
Abstract
Within a method for estimating a microelectronic fabrication product yield and a system for estimating the microelectronic fabrication product yield there is employed a specific mathematic algorithm for estimating yield of a new microelectronic fabrication product within at least one microelectronic fabrication facility. The specific algorithm is solved incident to parametric data correlation with existing production data within the at least one microelectronic fabrication facility.
Claims14
A method for estimating a microelectronic fabrication product yield comprising:
- providing a database containing therein historic production data for production of a series of existing microelectronic fabrication products fabricated within at least one microelectronic fabrication facility, the historic production data comprising:
- a series of historic die size options for the series of existing microelectronic fabrication products fabricated within the at least one microelectronic fabrication facility;
- a series of arbitrarily determined historic mask complexity factors for a series of masks employed for fabricating the series of existing microelectronic fabrication products within the at least one microelectronic fabrication facility;
- and
- a series of historic microelectronic fabrication product defect densities for the series of existing microelectronic fabrication products fabricated within the at least one microelectronic fabrication facility;
- determining for a new microelectronic fabrication product to be fabricated within the at least one microelectronic fabrication facility:
- a die size;
- an N value which equals a summation of mask complexity factors for a series of masks employed for fabricating the new microelectronic fabrication as determined through correlation with the series of historic mask complexity factors;
- and
- a Do value which is a baseline microelectronic fabrication product defect density determined through correlation with the series of historic microelectronic fabrication product defect densities;
- and
- calculating an estimated yield for the new microelectronic fabrication product using the equation:
- Est Yield=1/(1+(Do*(resiX/25.4)*(resiY/25.4)))N
- where resiX and resiY are chip's reference size X dimension and y dimension.
11 more elements
A method for estimating a semiconductor microelectronic fabrication product yield comprising:
- providing a database containing therein historic production data for production of a series of existing semiconductor microelectronic fabrication products fabricated within at least one microelectronic fabrication facility, the historic production data comprising:
- a series of historic die size options for the series of existing semiconductor microelectronic fabrication products fabricated within the at least one semiconductor microelectronic fabrication facility;
- a series of arbitrarily determined historic mask complexity factors for a series of masks employed for fabricating the series of existing semiconductor microelectronic fabrication products within the at least one semiconductor microelectronic fabrication facility;
- and
- a series of historic semiconductor microelectronic fabrication product defect densities for the series of existing semiconductor microelectronic fabrication products fabricated within the at least one semiconductor microelectronic fabrication facility;
- determining for a new semiconductor microelectronic fabrication product to be fabricated within the at least one semiconductor microelectronic fabrication facility:
- a die size;
- an N value which equals a summation of mask complexity factors for a series of masks employed for fabricating the new semiconductor microelectronic fabrication as determined through correlation with the series of historic mask complexity factors;
- and
- a Do value which is a baseline semiconductor microelectronic fabrication product defect density determined through correlation with the series of historic semiconductor microelectronic fabrication product defect densities;
- and
- calculating an estimated yield for the new semiconductor microelectronic fabrication product using the equation:
- Est Yield=1/(1+(Do*(resiX/25.4)*(resiY/25.4)))N
- where resiX and resiY are chip's reference size X dimension and Y dimension.
11 more elements
A system for estimating a microelectronic fabrication product yield comprising:
- a database containing therein historic production data for production of a series of existing microelectronic fabrication products fabricated within at least one semiconductor microelectronic fabrication facility, the historic production data comprising:
- a series of historic die size options for the series of existing microelectronic fabrication products fabricated within the at least one microelectronic fabrication facility;
- a series of arbitrarily determined historic mask complexity factors for a series of masks employed for fabricating the series of existing microelectronic fabrication products within the at least one microelectronic fabrication facility;
- and
- a series of historic microelectronic fabrication product defect densities for the series of existing microelectronic fabrication products fabricated within the at least one microelectronic fabrication facility;
- means for determining for a new microelectronic fabrication product to be fabricated within the at least one microelectronic fabrication facility:
- a die size;
- an N value which equals a summation of mask complexity factors for a series of masks employed for fabricating the new microelectronic fabrication as determined through correlation with the series of historic mask complexity factors;
- and
- a Do value which is a baseline microelectronic fabrication product defect density determined through correlation with the series of historic microelectronic fabrication product defect densities;
- and
- means for calculating an estimated yield for the new microelectronic fabrication product using the equation:
- Est Yield=1/(1+(Do*(resiX/25.4)*(resiY/25.4)))N
- where resiX and resiY are chip's reference size X dimension and Y dimension.
11 more elements
A system for estimating a semiconductor microelectronic fabrication product yield comprising:
- a database containing therein historic production data for production of a series of existing semiconductor microelectronic fabrication products fabricated within at least one semiconductor microelectronic fabrication facility, the historic production data comprising:
- a series of historic die size options for the series of existing semiconductor microelectronic fabrication products fabricated within the at least one semiconductor microelectronic fabrication facility;
- a series of arbitrarily determined historic mask complexity factors for a series of masks employed for fabricating the series of existing semiconductor microelectronic fabrication products within the at least one semiconductor microelectronic fabrication facility;
- and
- a series of historic semiconductor microelectronic fabrication product defect densities for the series of existing semiconductor microelectronic fabrication products fabricated within the at least one semiconductor microelectronic fabrication facility;
- means for determining for a new semiconductor microelectronic fabrication product to be fabricated within the at least one semiconductor microelectronic fabrication facility:
- a die size;
- an N value which equals a summation of mask complexity factors for a series of masks employed for fabricating the new semiconductor microelectronic fabrication as determined through correlation with the series of historic mask complexity factors;
- and
- a Do value which is a baseline semiconductor microelectronic fabrication product defect density determined through correlation with the series of historic semiconductor microelectronic fabrication product defect densities;
- and
- means for calculating an estimated yield for the new semiconductor microelectronic fabrication product using the equation:
- Est Yield=1/(1+(Do*(resiX/25.4)*(resiY/25.4)))N
- where resiX and resiY are chip's reference size X dimension and Y dimension.
11 more elements
Dependencies are inferred from the claim text.