Method for forming wiring structure
AssigneeMatsushita Electric Industrial Co., Ltd.
InventorTakeshi Harada
Life of this patent
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Abstract
A recess is formed in an insulating film, and then a conductive film is deposited over the insulating film so as to fill the recess. Thereafter, the conductive film is subjected to a first heat treatment. Subsequently, part of the conductive film located outside the recess is removed, and then the remaining part of the conductive film is subjected to a second heat treatment with the surface thereof exposed.
Claims14
A method for forming a wiring structure, the method comprising the steps of:
- forming a recess in an insulating film;
- depositing a conductive film over the insulating film such that the recess is filled with the conductive film;
- subjecting the conductive film to a first heat treatment;
- removing part of the conductive film located outside the recess, after the first heat treatment has been performed;
- and
- subjecting the remaining part of the conductive film to a second heat treatment with the surface thereof exposed, after the part of the conductive film located outside the recess has been removed.
A method for fabricating an electronic device including a first wiring structure and a second wiring structure, a method for forming the first wiring structure comprising the steps of:
- forming a first recess in a first insulating film formed on a substrate;
- depositing a first conductive film over the first insulating film such that the first recess is filled with the first conductive film;
- subjecting the first conductive film to a first heat treatment;
- removing part of the first conductive film located outside the first recess, after the first heat treatment has been performed;
- and
- subjecting the remaining part of the first conductive film to a second heat treatment with the surface thereof exposed, after the part of the first conductive film located outside the first recess has been removed,
- a method for forming the second wiring structure comprising the steps of:
- forming a second recess in a second insulating film formed on the substrate;
- depositing a second conductive film over the second insulating film such that the second recess is filled with the second conductive film;
- subjecting the second conductive film to a third heat treatment;
- and
- removing part of the second conductive film located outside the second recess,
- wherein the second recess has a width greater than the first recess.
Dependencies are inferred from the claim text.