Method and system for assembling a printed circuit board using a land grid array

A method for assembling circuit boards, comprising:

• a) receiving a land grid array assembly having a chip package and a loading component on a circuit board;
• b) applying a press device to compress a plurality of compression components that apply a coupling force to said loading component, wherein said loading component compresses said chip package to said circuit board;
• c) while continuing to apply said press device, tightening a plurality of fasteners associated with said plurality of compression components;
• and
• d) removing said press device from said plurality of compression components, wherein said plurality of fasteners compress said plurality of compression components.

A system for assembling circuit boards, said system comprising:

• a base for holding a circuit board having a land grid array assembly having a chip package, a loading component engaging the chip package, a plurality of compression components coupled to the loading component, and a plurality of fasteners engaging the plurality of compression components;
• a press ram for compressing the land grid array assembly to form an electrical contact between the chip package and the circuit board;
• and
• a pre-compression device coupled to said press ram and for compressing the compression components to apply a coupling force to the loading component while allowing the fasteners to be accessed for tightening.