US 2003/0224111 A1 · Continuous plating method of filament bundle and apparatus therefor

Abstract

A filament bundle is rewound from a reel, and passes through various sorts of liquid in processing vessels to be used for plating. The filament bundle passes through a fixed guide roller and a movable guide roller while it travels within the liquid in the processing vessel. The movable guide roller is moved periodically, the filament bundle is stretched and slackened by turns, whenever the filament bundle is slackened or untied, the bundle is loosened. The filament bundle with each filament subjected to the plating is taken up to a take-up reel.

Claims12

Dependent claims

A method of continuous plating of filament bundle in which

a filament bundle is rewound from a reel,
the filament bundle passes through various sorts of liquid in processing vessels to be used for plating,
the filament bundle passes through a fixed guide roller and a movable guide roller while it travels within the liquid in the processing vessel, the movable guide roller is moved periodically, the filament bundle is stretched and slackened by turns, whenever the filament bundle is slackened or untied, the bundle is loosened,
the filament bundle with each filament subjected to the plating is taken up to a take-up reel.

1 more element

An apparatus of continuous plating of filament bundle comprising

a rewinding part assembling a reel with filament bundle wound thereon,
a take-up part assembling a take-up reel,
various sorts of liquid processing vessels to be used for the plating,
an arrangement for which the filament bundle is rewound from the reel and passes through each processing vessel, and the filament bundle with each filament subjected to plating is taken up to the take-up reel,
a fixed guide roller and a movable guide roller, which the filament bundle passes through, provided in the processing vessel,
a mechanism for moving the position of the movable guide roller periodically,
an arrangement for which the filament bundle is stretched and slackened by turns while it travels within the liquid in the processing vessel.

4 more elements

Dependencies are inferred from the claim text.

Facts

Application

10/303,956Filed 26 Nov 2002

Priority

JP 2002-15538129 May 2002

Published

4 Dec 2003

Term ends

Not estimatedThe source records don’t support an estimate.

Classification8 codes

D06M 11/83
Treating fibres, threads, yarns, fabrics or fibrous goods made from such materials, with inorganic substances or complexes thereof; Such…
C23C 18/1632
Apparatus for electroless plating: features specific for the apparatus, e.g. layout of cells and of its equipment, multiple cells
C23C 18/1653
Multilayered product: two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
C23C 18/2086
Multistep pretreatment: with use of organic or inorganic compounds other than metals, first

Continuous plating method of filament bundle and apparatus therefor

Life of this patent

Continuous plating method of filament bundle and apparatus therefor

Life of this patent

Abstract

Claims12