Molding apparatus for molding semiconductor devices in which the mold is automatically treated with a releasing agent

A molding apparatus for molding semiconductor devices comprising:

• a mold part in which a molding process is performed;
• an in-magazine part which stores normal lead frame strips and dummy lead frame strips to be supplied to the mold part;
• a tablet loading part which stores tablets to be supplied to the mold part, said tablet loading part including;
• a molding compound tablet feeder which stores molding compound tablets to be supplied to the mold part in a first operation mode;
• a releasing tablet feeder which stores releasing tablets to be supplied to the mold part in a second operation mode;
• and
• a tablet container feeder which is selectively supplied with molding tablets from the molding compound tablet feeder in the first operation mode and releasing tablets from the releasing tablet feeder in the second operation mode;
• a stack magazine part that stacks products molded in the mold part;
• and a pick-up part which transfers the products molded by the mold part to the stack magazine part.

A molding apparatus for molding semiconductor devices comprising:

• a mold part in which a molding process is performed;
• an in-magazine part which stores normal lead frame strips and dummy lead frame strips to be supplied to the mold part;
• a tablet loading part which stores tablets to be supplied to the mold part;
• a stack magazine part that stacks products molded in the mold part;
• a by-product unloading part which stores by-products molded in the mold part according to a first operation mode;
• and
• a pick-up part which transfers products molded products in the mold part to the stack magazine part in a second operation mode and transfers the by-products to the by-product unloading part according to the first operation mode.

A molding apparatus for molding semiconductor devices comprising:

• a mold part in which a molding process is performed;
• an in-magazine part which stores normal lead frame strips and dummy lead frame strips to be supplied to the mold part, the in-magazine part including:
• a normal lead frame strip magazine part which stores normal lead frame strip magazines housing the normal lead frame strips to be supplied to the mold part in a first operation mode;
• a dummy lead frame strip magazine part which stores dummy lead frame strip magazines housing the dummy lead frame strips to be supplied to the mold part in second operation mode;
• and
• a magazine switching part that controls the transfer of the normal lead frame strips and dummy lead frame strips to the mold part according to the first and second operation modes;
• a tablet loading part which stores tablets to be supplied to the mold part, the tablet loading part including:
• a molding compound tablet feeder which stores molding compound tablets to be supplied to the mold part in a first operation mode;
• a releasing tablet feeder which stores releasing tablets to be supplied to the mold part in a second operation mode;
• and
• a tablet container feeder which is selectively supplied with molding tablets from the molding compound tablet feeder in the first operation mode and releasing tablets from the releasing tablet feeder in the second operation mode;
• a stack magazine part that stacks products molded in the mold part;
• a by-product unloading part that unloads by-products molded in the mold part;
• and
• a pick-up part which transfers the products molded by the mold part to the stack magazine part in the first operation mode and transfers the by-products to the by-product unloading part in the second operation mode.

A method of automatically performing a mold release agent treatment process in a molding apparatus comprising:

• providing a molding apparatus including:
• a mold part in which a molding process is performed;
• an in-magazine part which stores normal lead frame strips and dummy lead frame strips to be supplied to the mold part;
• a tablet loading part which stores molding compound tablets and mold releasing tablets to be supplied to the mold part;
• a stack magazine part that stacks products molded in the mold part;
• a by-product unloading part that unloads by-products molded in the mold part;
• a pick-up part which transfers the products molded by the mold part to the stack magazine part in a first operation mode and transfers the by-products to the by-product unloading part in a second operation mode;
• and
• a controller;
• switching from a normal molding operating mode to a mold release agent treatment process mode;
• supplying the dummy lead frame strips from the in-magazine part and mold releasing tablets from the tablet loading part to said mold part;
• transferring by-products molded in the mold part to the by-product unloading part;
• discharging the by-products.