Power plane region of printed circuit board with power blocks having an arc-shaped boundary
AssigneeVIA Technologies, Inc.
InventorsMing-Chou Wu, Chi-Te Tai, Ming-Wei Huang, Jeng-Yuan Chang
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AssigneeVIA Technologies, Inc.
InventorsMing-Chou Wu, Chi-Te Tai, Ming-Wei Huang, Jeng-Yuan Chang
Estimating the term…
A multi-layer printed circuit board includes at least a ground plane for providing a ground level, at least a signal plane having a plurality of trace regions for transmitting signals, at least a power plane region having a plurality of power blocks for individually providing a plurality of voltage levels, and at least a via for electrically connecting the trace regions with the power plane region or the ground plane. Two adjacent power blocks with different voltage levels are separated by an insulating line. The insulating line has a plurality of first insulating sectors, and a plurality of second insulating sectors for connecting two adjacent first insulating sectors when an included angle of the adjacent first insulating sectors is greater than a predetermined value.
A multi-layer printed circuit board of a computer system that comprises a north bridge chipset, the multi-layer printed circuit board comprising:
A power plane region of a multi-layer printed circuit board for providing a plurality of voltage levels, the multi-layer printed circuit board further comprising at least a ground plane for providing a ground reference level, at least a signal plane comprising a plurality of trace regions that are conductors for transmitting signals, and at least an opening for electrically connecting the trace regions with the power plane region or the ground plane, the power plane region comprising:
A computer system comprising a multi-layer printed circuit board, the multi-layer printed circuit board comprising:
Dependencies are inferred from the claim text.