High density laminated substrate structure and manufacture method thereof

A laminated substrate manufacture method, comprising:

• providing a first supporter;
• forming a patterned circuit on the first supporter;
• forming a first dielectric layer on the first supporter, wherein the patterned circuit is covered by the first dielectric layer to form a dielectric layer having the patterned circuit on the first supporter;
• providing a second supporter;
• forming a plurality of via studs on the second supporter;
• forming a second dielectric layer on the second supporter, wherein the via studs are extruded from the second dielectric layer to form a dielectric layer having the via studs on the second supporter;
• and
• aligning and laminating a plurality of dielectric layers having the patterned circuit and a plurality of dielectric layers having the via studs, so that the via studs penetrate through the first dielectric layer and electrically couple to the patterned circuit.

A laminated substrate manufacture method, comprising:

• forming a patterned circuit on a first supporter;
• forming a first dielectric layer on the first supporter, wherein the patterned circuit is covered by the first dielectric layer to form a dielectric layer having the patterned circuit on the first supporter;
• forming a plurality of via studs on a second supporter;
• forming a second dielectric layer on the second supporter, wherein the via studs are extruded from the second dielectric layer to form a dielectric layer having the via studs on the second supporter;
• providing at least a via opening layer, wherein the via opening layer has a plurality of openings;
• and
• aligning and laminating a plurality of dielectric layers having the patterned circuit, a plurality of dielectric layers having the via stud, and the via opening layer so that the via studs penetrate through the first dielectric layer and electrically couple to the patterned circuit.

A laminated substrate manufacturing process, comprising steps of:

• forming a plurality of patterned circuit parts;
• forming a plurality of via stud parts;
• forming a plurality of via opening parts;
• and
• laminating the patterned circuit parts, the vis stud parts amd the via opening parts to complete the laminated substrate.