Method of producing an electronic device and electronic device

An electronic device comprising electronic components arranged on a stamped sheet-metal part and electrically connected to one another by said part, the stamped sheet-metal part and the electronic components being encapsulated in a thermoplastic, insulating material by the injection-molding process, characterized in that the stamped sheet-metal part (2) has at least one region (3) similar to a protective shield, under which the electronic components are arranged, and in that the electronic components (4) are arranged downstream of the stamped sheet-metal part (2) in the direction of injection pressure (9) of the heated, thermoplastic, insulating material (5).

The electronic device as claimed in at least one of the aforementioned claims, characterized in that the stamped sheet-metal part (2) is connected to the electronic components (4) in such a way that very little thermal energy is transferred to the electronic components (4) from the heated stamped sheet-metal part (2).

The electronic device as claimed in at least one of the aforementioned claims, characterized in that the at least one region (3) similar to a protective shield of the stamped sheet-metal part (2) is formed in a way similar to a surface area and this surface area is arranged opposite at least one electronic component (4).

The electronic device as claimed in at least one of the aforementioned claims, characterized in that the stamped sheet-metal part (2) with the regions (3) similar to a protective shield and the conductor tracks (7) is formed as a self-supporting, metallic structure.

The electronic device as claimed in at least one of the aforementioned claims, characterized in that the electronic components (4) to be protected are arranged between the stamped sheet-metal part (2) and a lower housing part (10).

The electronic device as claimed in at least one of the aforementioned claims, characterized in that at least one chamber-like formation (12) is formed in the lower housing part (10).

The electronic device as claimed in at least one of the aforementioned claims, characterized in that the regions (3) similar to a protective shield have at least one aperture (14), which permits specific filling of the chamber-like formation (12) in the lower housing part (10) and/or of the entire lower housing part (10) with thermoplastic, insulating material.

The electronic device as claimed in at least one of the aforementioned claims, characterized in that an elastic, vibration-damping material comes at least partly into contact with the electronic components (4) to be protected.

The electronic device as claimed in at least one of the aforementioned claims, characterized in that the terminal conductors (11) of the electronic components (4) are welded, adhesively bonded or soldered to the stamped sheet-metal part (2).

The electronic device as claimed in at least one of the aforementioned claims, characterized in that the terminal conductors (11) of the electronic components (4) are bent in an S-shaped manner.

The electronic device as claimed in at least one of the aforementioned claims, characterized in that the terminal conductors (11) of the electronic components (4) are bent in such a way that the electronic components (4) are at a desired angle in relation to the stamped sheet-metal part (2).

The electronic device as claimed in at least one of the aforementioned claims, characterized in that the stamped sheet-metal part (2) has connecting elements (8) for contacting other electronic devices.