Sealed electronic device packages with transparent coverings

An electronic device package comprising:

• a carrier substrate having at least one conductive trace thereon, said at least one conductive trace having a first end and a second end;
• an electronic device sensitive to light or other radiation attached to a surface of said carrier substrate;
• at least one electrical interconnection between said electronic device and said first end of said at least one conductive trace;
• a barrier molded to said surface of said carrier substrate and forming a wall surrounding a central exposed area that contains said electronic device and said at least one electrical interconnection;
• and
• a transparent lid covering at least a portion of said electronic device and said at least one electrical interconnection, said transparent lid having substantially the same area and configuration as said central exposed area.

A method for assembling a package containing an electronic device sensitive to light or other radiation comprising:

• mounting said electronic device on a carrier substrate having at least one conductive trace thereon, said at least one conductive trace having a first end and a second end;
• providing at least one electrical interconnection between a bond pad on said electronic device and said first end of said at least one conductive trace;
• encapsulating said first end of said at least one conductive trace, said at least one electrical interconnection and said bond pad of said electronic device with a nonconductive material dispensed in liquid form;
• covering a surface of said electronic device with a transparent lid;
• curing the liquid nonconductive material to at least a semisolid state;
• and
• retaining said transparent lid by an adhesive interface with said nonconductive material.

The electronic device package comprising:

• a carrier substrate having at least one conductive trace thereon, said at least one conductive trace having a first end and a second end;
• an electronic device sensitive to light or other radiation attached to a surface of said carrier substrate;
• at least one electrical interconnection between a bond pad on said electronic device and said first end of said at least one conductive trace;
• a layer of nonconductive material encapsulating said first end of said at least one conductive trace, said at least one electrical interconnection and said bond pad;
• and
• a transparent lid covering a surface of said electronic device, said transparent lid having edges in adhesive contact with said nonconductive material.

A method for assembling a package containing an electronic device sensitive to light or other radiation comprising:

• mounting said electronic device on a carrier substrate having at least one conductive trace thereon, said at least one conductive trace having a first end and a second end;
• providing at least one electrical interconnection between a bond pad on said electronic device and said first end of said at least one conductive trace;
• and
• enclosing said first end of said at least one conductive trace, said at least one electrical interconnection and said electronic device within a shell formed entirely of a transparent material.

The electronic device package comprising:

• a carrier substrate having at least one conductive trace thereon, said at least one conductive trace having a first end and a second end;
• an electronic device sensitive to light or other radiation attached to a surface of said carrier substrate;
• at least one electrical interconnection between a bond pad on said electronic device and said first end of said at least one conductive trace;
• and
• a shell formed entirely of a transparent material attached to said surface of said carrier substrate, said shell enclosing said first end of said at least one conductive trace, said at least one electrical interconnection and said electronic device.

A method for assembling a package containing an electronic device sensitive to light or other radiation comprising:

• mounting said electronic device on a carrier substrate having at least one conductive trace thereon, said at least one conductive trace having a first end and a second end;
• providing at least one electrical interconnection between said electronic device and said first end of said at least one conductive trace;
• loading a transparent lid into a mold tooling element;
• loading said carrier substrate with said electronic device and said at least one electrical interconnection into said mold tooling element so that a surface of said electronic device is aligned against said transparent lid;
• filling said mold tooling element with molding compound;
• forming a molded layer on said carrier substrate to encapsulate said at least one electrical interconnection and a perimeter of said electronic device;
• and
• retaining said transparent lid with said molded layer.

An electronic device package comprising:

• a carrier substrate having at least one conductive trace thereon, said at least one conductive trace having a first end and a second end;
• an electronic device sensitive to light or other radiation attached to a surface of said carrier substrate;
• at least one electrical interconnection between a bond pad on said electronic device and said first end of said at least one conductive trace;
• a transparent lid covering a surface of said electronic device, said transparent lid having edges;
• and
• a layer of molding compound on said carrier substrate encapsulating said at least one electrical interconnection, a perimeter of said electronic device and said edges of said transparent lid.