Wiring structure on a semiconducting substrate
AssigneeMitsubishi Denki Kabushki Kaisha
InventorsKazuyoshi Okamoto, Hirohiko Wakasugi
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Abstract
A semiconductor device has a dummy pattern including an underlying layer which is formed on a semiconductor substrate and in which a plurality of word lines from N−2 to N+2 are arranged in parallel, a plurality of blocks each of which has a plurality of dummy sheets arranged in such a way that each of them spreads over the two word lines neighboring in the direction along the word lines from N−2 to N+2, and a plurality of dummy sheets arranged between the plurality of blocks in such a way that each of them spreads over the two word lines neighboring between the blocks.
Claims7
A semiconductor device comprising:
- a wiring layer which is formed on a semiconductor substrate and in which a plurality of wirings are arranged in parallel;
- and
- a dummy pattern including a plurality of blocks each of which has a plurality of dummy sheets arranged in such a way that each of them spreads over two wirings neighboring in the direction along the wiring and a plurality of dummy sheets arranged between the plurality of blocks in such a way that each of them spreads over two wirings neighboring between the blocks.
A semiconductor device comprising:
- a wiring layer which is formed on a semiconductor substrate and in which a plurality of wirings are arranged in parallel;
- a first layer in which a plurality of dummy sheets are arranged on the wirings in the direction along the wiring;
- a second layer in which the dummy sheets are arranged in such a way that each of them spreads over two neighboring dummy sheets arranged on the first layer;
- and
- an electric connection part for electrically connecting the dummy sheet arranged on the first layer to the dummy sheet arranged on the second layer.
Dependencies are inferred from the claim text.