Direct-connect signaling system
AssigneeSilicon Pipe, Inc.
InventorsJoseph C. Fjelstad, Para K. Segaram, Belgacem Haba
Life of this patent
Estimating the term…
Abstract
A direct-connect signaling system including a printed circuit board and first and second integrated circuit packages disposed on the printed circuit board. A plurality of electric signal conductors extend between the first and second integrated circuit packages suspended above the printed circuit board.
Claims105
An integrated circuit package comprising:
- a substrate;
- an integrated circuit die disposed on a first surface of the substrate and including a first plurality of contacts;
- and
- a plurality of conductive traces disposed on the first surface of the substrate and extending along the first surface from the first plurality of contacts to an exposed region of the first surface.
An integrated circuit package comprising:
- an integrated circuit die having a first set of contacts and a second set of contacts;
- a substrate having a first surface disposed adjacent the integrated circuit die and a second surface opposite the first surface;
- a first set of conductive structures coupled to the first set of contacts and extending from the first surface through the substrate to the second surface;
- and
- a second set of conductive structures coupled to the second set of contacts and extending to an edge of the substrate formed between the first and second surfaces.
A signaling system comprising:
- a printed circuit board;
- a first integrated circuit package disposed on the printed circuit board;
- a second integrated circuit package disposed on the printed circuit board;
- and
- a plurality of electric signal conductors suspended above the printed circuit board and extending between the first and second integrated circuit packages.
A signaling system comprising:
- a printed circuit board;
- a first integrated circuit package disposed on the printed circuit board;
- a second integrated circuit package disposed on the printed circuit board;
- and
- a cable secured to the first integrated circuit package and to the second integrated circuit package, the cable including a plurality of electric signal conductors.
A signaling system comprising:
- a first circuit board;
- a first integrated circuit package disposed on the first circuit board and including a first integrated circuit die disposed on a first substrate;
- a second integrated circuit package including a second integrated circuit die disposed on a second substrate;
- and
- a cable, including a plurality of electric signal conductors, secured to the first substrate and to the second substrate.
An integrated circuit package for mounting on a circuit board, the integrated circuit package comprising:
- a substrate;
- a first integrated circuit die disposed on the substrate;
- a second integrated circuit die disposed on the substrate;
- and
- a cable electrically coupled between the first integrated circuit die and the second integrated circuit die.
A method of manufacturing an integrated circuit package that includes a first die and a second die, the method comprising:
- mounting the first die to a substrate of the integrated circuit package;
- testing the first die with a test apparatus after the first die is mounted to the substrate;
- mounting the second die to the substrate;
- testing the second die with the test apparatus after the second die is mounted to the substrate;
- and
- coupling a first cable between the first die and the second die if the first die and the second die are successfully tested by the test apparatus.
The method of 93 wherein the first and second die are mounted to a first surface of the substrate, the method further comprising disposing a plurality of structures in the substrate that establish conductive paths from the first surface of the substrate to a second surface of the substrate.
The method of 98 wherein testing the second die with the test apparatus comprises coupling the second cable between the test apparatus and the second plurality of traces.
The method of 99 wherein testing the second die with the test apparatus comprises coupling a third cable between the test apparatus and the second plurality of traces.
Dependencies are inferred from the claim text.