Thermally or electrically-conductive form-in-place gap filter
AssigneeParker-Hannifin Corporation
InventorsMichael H. Bunyan, Miksa de Sorgo
Life of this patent
Estimating the term…
Abstract
Application of a thermally and/or electrically conductive compound to fill a thermal and/or EMI shielding gap between a first and a second surface. A supply of a fluent, form-stable compound is provided as an admixture of a cured polymer gel component, and a particulate filler component. An of the compound is dispensed from a nozzle or other orifice under an applied pressure onto one of the surfaces which, when opposed, form the gap, or into the gap formed between the surfaces. The gap is at least partially filled by at least a portion of the dispensed compound.
Claims29
A method of filling a gap between a first and a second surface, the method comprising the steps of:
- (a) providing a supply of a fluent, form-stable compound comprising an admixture of:
- (I) a cured polymer gel component;
- and (II) a particulate filler component;
- (b) providing an orifice connected in fluid communication with the supply of the compound;
- (c) dispensing from the orifice under an applied pressure an amount of the compound;
- and
- (d) prior to or following step (c), forming the gap between the first and the second surface, the gap being at least partially filled by at least a portion of the compound dispensed in step (c).
A fluent, form-stable compound for filling a gap between a first and a second surface, the compound comprising an admixture of:
- (a) a cured gel component;
- and
- (b) a particulate filler component;
- whereby the compound is dispensable through an orifice under an applied pressure.
Dependencies are inferred from the claim text.