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US 2003/0222124 A1Published application
Radio wave soldering method for semiconductor device
OwnerYu-Peng Chung, Robert Lee +1inventors
InventorsYu-Peng Chung, Robert Lee, Max Lin
Life of this patent
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Abstract
A radio wave soldering method provides instant heating for substrate of semiconductor device. The radio wave soldering method can heat a local portion of a substrate rapidly to 500-600° C. The method is suitable for substrate of semiconductor device with limit heat-resistance.
Claims11
A radio wave soldering method for semiconductor device, comprising following steps:
- preparing at least one substrate patterned with a circuit, the circuit being applied with a solder thereon and a plurality of dies to be soldered being attached on the circuit applied with the solder;
- moving the substrate with the circuit and the dies toward an induction coil operated at radio wave frequency, an eddy current being generated to increase temperature of the circuit, whereby the solder is melted and the dies are soldered to the circuit.
Dependencies are inferred from the claim text.