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US 2003/0221817 A1Published application
Rack mountable computer component cooling method and device
AssigneeRackSaver, Inc.
InventorsJohn V. Smith, Victor P. Hester, William A. Wylie
Life of this patent
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Abstract
According to at least one of the disclosed embodiments of the present invention, there is provided a method and apparatus for mounting heat sinks for a rack mounted computer component. The heat sink is adapted to be mounted on a vertically mounted computer component blade where the heat sink is disposed such that vertical air flow provides sufficient contact with the heat sink fins for efficient and rapid cooling purposes.
Claims14
A heat sink for an active component mounted on an upright support, comprising:
- a base portion having a series of spaced aparat fins extending therefrom to provide a relatitvely large surface area to dissipate heat thereforem as substantially vertically flowing cooling air passes between the fins;
- said base portion and said fins being composed of heat conducting material;
- said base portion for mounting in a generally upright position with its foms extending in a generally upright position, and
- the ratio of the height of the fins to the height of the base portion is greater than seven.
1 more element
A method of utilizing a heat sink for helping cool an active component, comprising:
- mounting a support in a generally upright manner;
- mounting the active component on one side of the support;
- mounting the heat sink on the active component in a generally upright manner, the heat sink having spaced-apart fins extending from a base portion in generally upright manner;
- and
- causing air to flow in said generally upright manner past the fins of the heat sink.
2 more elements
Dependencies are inferred from the claim text.